In the ever-evolving world of technology, MediaTek has once again raised the bar with the announcement of two cutting-edge Wi-Fi 7 chips – the Filogic 360 and Filogic 860. These chips, showcased at CES 2023, promise to revolutionize connectivity in various devices, from smartphones to laptops and beyond.

MediaTek’s Innovation

Filogic Series Unveiling

MediaTek’s Filogic series takes center stage at CES 2023, marking a significant leap forward in Wi-Fi technology. The Filogic 360 and Filogic 860 emerge as the stars of the show, each tailored for specific applications in the tech landscape.

Filogic 360: The Compact Powerhouse

The Filogic 360, a scaled-down version of its predecessor, the Filogic 380, is designed to fit seamlessly into smartphones, tablets, laptops, routers, and various IoT devices. This compact chip boasts fundamental Wi-Fi 7 capabilities, including MU-MIMO, 4096 QAM, and impressive download speeds reaching 2.9Gbps. Additionally, it features dual Bluetooth 5.4 connectivity and supports LE audio – an exciting addition for tech enthusiasts.


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Filogic 860: The Standalone Marvel

On the other hand, the Filogic 860 emerges as a standalone marvel with a 3-core CPU. Positioned as a reduced version of the Filogic 880, this chip brings forth advanced features such as automatic frequency coordination, a 160Hz channel bandwidth, and a robust 4096 QAM scheme. Boasting a maximum throughput of 7.2Gbps, the Filogic 860 supports single Ethernet connections of up to 10Gbps, including 1 x 2.5Gbps and 4 x 1Gbps connections. Manufacturers can also configure it with PCIe Gen 3 host controllers or integrate USB 3.2 ports, offering flexibility for wireless router production. The Filogic 860’s 3x Cortex-A78 cores, with a peak speed of 1.8GHz, and an accompanying NPU enhance its capability to handle resource-intensive tasks efficiently.

Future of Connectivity

Mass Production and Availability

MediaTek is quick to announce that devices featuring the Filogic 360 and Filogic 860 Wi-Fi 7 chips are already in mass production and are set to hit the market by mid-2024. This rapid turnaround emphasizes the company’s commitment to delivering cutting-edge technology to consumers.

Premium Features for High Demand

The premium features embedded in the Filogic 360 and Filogic 860 chips are expected to generate significant demand. As the tech industry continues to embrace Wi-Fi 7, these chips are poised to become highly sought after for their unparalleled performance and versatility.


In a world where connectivity is key, MediaTek’s Filogic 360 and Filogic 860 emerge as game-changers. From the compact yet powerful Filogic 360 to the standalone marvel Filogic 860, these Wi-Fi 7 chips are set to redefine how we experience connectivity in our devices. With mass production already underway, the future looks promising for these innovative MediaTek creations.


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