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Honor has recently launched its first flip-style foldable phone, the Honor Magic V Flip, in China. CEO Zhao Ming discussed Honor’s venture into small folding phones with the Magic V Flip, while also touching upon the previously released Honor Magic V2. Ming hinted at the imminent arrival of the Magic V3.

According to Ming, the Honor Magic V3 is currently undergoing intensive development and is expected to set new benchmarks in foldable phone design. Ming reaffirmed Honor’s commitment to innovation, noting that the Magic V2 remains the thinnest foldable phone on the market even after almost a year since its 9.9mm thickness test.

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The Honor Magic V2, launched in July 2023, gained recognition for its ultra-thin profile, measuring only 4.7mm when unfolded and 9.9mm when folded. This achievement marked a significant milestone in foldable phone technology, surpassing many traditional straight-screen phones in terms of slimness.

While specific details about the Honor Magic V3’s specifications remain scarce, leaks suggest it may feature the Snapdragon 8 Gen 3 chipset and boast a battery exceeding 5,000mAh, along with a side-facing fingerprint scanner. Currently, the Vivo X Fold 3 Pro holds the record for the largest battery capacity in a foldable phone, packing a 5,700mAh cell while maintaining a slim profile of 5.2mm unfolded and 11.2mm folded.

The Honor Magic V3 is expected to debut in July in China, promising enthusiasts and consumers alike a continuation of Honor’s innovative approach to foldable phone technology.

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