The forthcoming Google Pixel 9 series, comprising the standard Pixel 9 and the 9 Pro model, is anticipated to make its debut around October this year, boasting significant hardware enhancements. Both the Pixel 9 and Pixel Fold 2 are set to feature Google’s latest proprietary System-on-Chip (SoC), the Tensor G4. According to a recent report from Korea, this new SoC is expected to deliver improved thermal performance and power efficiency to Google’s upcoming devices. The report further reveals that Samsung’s foundry will once again manufacture the Tensor G4, utilizing a cutting-edge 4nm process. This upgrade aims to address shortcomings found in previous generations, positioning Google’s offerings more competitively against rival Android flagships.
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Despite Samsung’s Exynos chipsets historically receiving criticism, there’s renewed interest in Samsung’s foundry due to the surprisingly positive reception of the Galaxy S24 featuring the Exynos 2400 chipset. It’s speculated that low initial expectations allowed the Exynos 2400 to exceed them, contributing to its perceived success. Nevertheless, Samsung’s foundry stands to gain financially from this trend, regardless of the reasons behind the chipset’s improved reception.
Expect Google Pixel 9 to Generate Less Heat and Offer Enhanced Battery Life
In the tech community, there’s a growing chorus advocating for reduced reliance on Taiwanese chip manufacturer TSMC, which currently dominates around 50% of the market share. Prominent figures such as Meta’s Mark Zuckerberg and OpenAI CEO Sam Altman are among those pushing for diversification. Samsung is positioned to capitalize on this initiative, demonstrating readiness and enthusiasm to play a significant role in chip manufacturing.
As for the Google Pixel 9 series and its Tensor G4 SoC, only time will reveal the extent of their upgrades and competitiveness in the market.
